Wider market
GlobalFoundries
Semiconductor foundry manufacturing specialty and mature-node chips at fabs in Malta NY, Dresden, and Singapore, for automotive, IoT, and mobile device makers.
48 open roles
2026 Skillbridge Military Internship 1 - Vermont
2026 Skillbridge Military Internship 2 - Vermont
2026 Skillbridge Military Internship 3 - Vermont
2026 Skillbridge Military Internship 4 - Vermont
2H University Intern - Clean Tech Engineering Module
2H University Intern - Environmental & Sustainability
2H University Intern - FR CMOS Device Engineering
2H University Intern - IP Program Management & QA
2H University Intern - Implant Process Engineering
2H University Intern - Industrial Engineering (Layout)
2H University Intern - PVD Equipment
2H University Intern - Process Integration
2H University Intern - Process Integration
2H University Intern - Technology Development
2H University Intern, AI-Driven Process Intern (Advanced Process Control)
2H University Intern, Corporate Communications Intern (APAC)
3D Heterogeneous Integration Design Enablement Engineer (2026 New College Graduate)
Associate Engineer (AE) Process Engineering – New College Graduate (Diploma Graduate)
Associate Engineering Intern, CVD Equipment (Diploma)
Associate Engineering Intern, Tapeout Integration (Diploma)
Associate Process Engineer Intern, Lithography (Diploma)
Associate Process Engineer Intern, Metrology Recipe Automation (Diploma)
Equipment Engineering Intern, Metrology (July to December)
Factory Automation Engineering Intern (Fall 2026)
Field Application Engineer (2026 New College Graduate)
Global Tapeout and Mask Operations, Biz App and Data Engineer (2026 New College Graduate)
Human Resources Intern, Digital & AI (Summer 2026)
IP & Design Engineering Intern (Fall 2026)
Implant Equipment Assistant Engineer (Diploma Intern)
Implant Equipment Assistant Engineer (Diploma Intern)
Industrial Engineering & Tool Remarketing Intern (Diploma)
Intern
Intern - Fab Engineering (AE)
Internship - Cross Module Digital Manufacturing & Process Optimization
Junior Engineer Tapeout Systems/Tapeout Operations
Junior Financial Analyst
Junior Financial Analyst
Junior Silicon Photonics Design Engineer
Junior Software Developer
Maintenance Technician Apprenticeship
Packaging Design Integration Engineer (2026 New College Graduate)
Packaging Integration Engineer (2026 New College Graduate)
Polytechnic Intern - Year 2026
Position 2H University Intern - FR CMOS Device Engineering
SoC Design Verification Engineer (2026 New College Graduate)
Software Engineer Intern (Diploma)
Tapeout Engineer, 2026 New College Graduate
University Intern - Year 2026